Event Information

Through Hole Technology (THT) in PCB Assembly

Dates: August 20-21, 2026
Location: Cloud 11, Bangkok, Thailand

If you encounter any difficulties completing the form, feel free to reach out to us at marketing.tec@dksh.com, and our specialist will be happy to assist you.

Through Hole Technology (THT) in PCB Assembly

Join DKSH's seminar on Through Hole Technology in PCB assembly, Bangkok, 20-21 August 2026. Hosted by DKSH at Cloud 11, this seminar gives a practical overview of Through Hole Technology (THT) and its role in modern PCB assembly, designed for manufacturing engineers, process engineers, production managers, quality engineers, and other professionals working in PCB assembly and electronics manufacturing.

 

Participants will learn about THT processes, component insertion methods, wave and selective soldering techniques, quality standards, and common manufacturing challenges, along with best practices for achieving reliable solder joints, improving production efficiency, and ensuring long-term durability in high-reliability applications such as automotive, industrial, aerospace, and power electronics.

 

If you have any questions before the event, feel free to reach out to us at marketing.tec.th@dksh.com and we'll be happy to help.